Hybrid Component: IC die

Requirement:

• 15 PASAs (44 pads)
• 15 SCAs (30 pads)
• 2 digital buffers
• 1 analog buffer

Justification:

Number of PASAs and SCAs (16 channel each) detemined by number of detector channels (240). One digital buffer needed for CMOS level signals and one for PECL level signals. Analog buffer necessary due to low capacitive drive capability of SCA output buffer.